OVERVIEW

 

Wafer-Level Reliability Test (WLR Test) Toolkit along with National Instruments PXI SMU modules are used for semiconductor device reliability estimation at the extreme ends of the device specifications (voltage and temperature).

Toolkit accelerates device wearout and models the usable lifetime against known failure mechanisms. These tests can be performed on a wafer or a packaged level.

WLR Test Toolkit involves techniques to stress and measure the response of the device to monitor for any signs of degradation. It provides negative bias temperature instability (NBTI) and hot-carrier injection (HCI) mechanisms for device degradation parameters estimation. All tests are designed per JEDEC standards.